Electroplating Factors You Want to Know

Cathode: The object to be plated, such as various connector terminals.
Anode: If soluble, it’s the metal to be plated; if insoluble, it’s usually precious metals like platinum or iridium oxide.
Electroplating Solution: Contains the metal ions to be plated.
Electroplating Tank: Used to store the electroplating solution, considering strength, corrosion resistance, and temperature resistance.
Rectifier: Provides the DC power source for the electroplating process

Copper Plating: Enhances adhesion and corrosion resistance.
Nickel Plating: Improves corrosion resistance.
Gold Plating: Enhances electrical contact resistance and signal transmission.
Palladium-Nickel Plating: Improves electrical contact resistance, signal transmission, and has better wear resistance than gold.
Tin-Lead Plating: Enhances solderability.

Pure Water: Impurities should be below 5ppm.
Metal Salts: Provide the metal ions for plating.
Anode Dissolution Additives: Balance the anode dissolution rate.
Conductive Salts: Improve the conductivity of the solution.
Additives: Buffer agents, brighteners, leveling agents, softeners, wetting agents, and inhibitors.

Current Density: The current per unit plating area. Higher current density results in thicker films but can cause burning or rough surfaces if too high.
Plating Position: The position of the object in the solution affects film thickness distribution.
Stirring Conditions: Better stirring improves electroplating efficiency.
Current Waveform: Better filtration leads to more uniform plating structure.
Solution Temperature: Gold plating 50-60°C, nickel plating 50-60°C, tin-lead plating 18-22°C, palladium-nickel plating 45-55°C.
Solution pH: Gold plating 4.0-4.8, nickel plating 3.8-4.4, palladium-nickel plating 8.0-8.5.
Solution Specific Gravity: Lower specific gravity indicates poorer conductivity and lower efficiency.

Tin-Lead Alloy Plating: For soldering, typically 100-150 microinches.
Nickel Plating: Commonly used as a base layer in electronics, usually over 50 microinches.
Gold Plating: Due to its high cost, thickness is chosen based on practical use, cost, and environmental resistance, typically over 50 microinches for severe corrosion tests.

Appearance Inspection: Visual inspection or magnifying glass (4-10x).
Thickness Measurement: X-ray fluorescence thickness gauge.
Adhesion Test: Bend test or tape test.
Solderability Test: Dip test, requiring over 95% uniform and smooth solder coverage.
Steam Aging Test: Check for discoloration or corrosion spots.
Anti-discoloration Test: Oven baking test.
Corrosion Resistance Test: Salt spray, nitric acid, sulfur dioxide, hydrogen sulfide tests.

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